Standard Multi-Layer PCB Stackups

This article defines the materials and the standard stackups our suppliers use for 2-layer to 10-layer PCB’s. You can provide your own custom stackup but these are the most commonly used. When designing your PCB's if you design with these stackups in mind it should help cut lead-times and improve yields.

Core PCB/Prepreg Materials Commonly Use

Manufacturer Material (datasheet linked) TG Rating
TUC TU-662 150
HTE HTE-590-2 155
TUC TU-722 175
Isola 370HR 180
TUC TU-863 180
TUC TU-768 180
TUC TU-872LK 200
Prepreg Type Thickness Resin Content Dielectric Constant
2116 0.12mm (0.0047”) 53% 4.2
2116HR 0.12mm (0.0047”) 55% 4.2
7630 0.2mm (0.0078”) 50% 4.3

Stackups

Note: Top and Bottom layers are plated from 0.5oz to 1.0oz

Manufacturer Material (datasheet linked) TG Rating
TUC TU-662 150
HTE HTE-590-2 155
TUC TU-722 175
Isola 370HR 180
TUC TU-863 180
TUC TU-768 180
TUC TU-872LK 200

Layer Order Layer Name Material Type Material Description Dielectric Constant Thickness Copper Weight
1 Top Copper Signal 0.035mm (0.0013”) 1oz
Core 4.2 1.50mm (0.060”)
2 Top Copper Signal 0.035mm (0.0013”) 1oz
Final board thickness: 1.6mm ± 0.13mm (0.062” ± 0.005”)
Layer Order Layer Name Material Type Material Description Dielectric Constant Thickness Copper Weight
1 Top Copper Signal 0.035mm (0.0013”) 1oz
7630 (1 Sheet) Prepreg 4.3 0.20mm (0.008”)
1 Top Copper Signal 0.035mm (0.0013”) 1oz
Final board thickness: 1.6mm ± 0.13mm (0.062” ± 0.005”)